Copper Clad Molybdenum

Copper Clad Molybdenum (CPC, CMC, and SCMC) are structures comprised of alternating layers of Mo/MoCu and Cu materials. The laminated structures include Cu/Mo/Cu, Cu/MoCu/Cu, Cu/Mo/Cu/Mo/Cu. Multiple layers of Mo and Cu, or MoCu and Cu, in various combinations, are symmetrically roll-bonded to exacting thickness ratios. These firmly bonded layers must not vary in thickness by more than 10% from specifications. All interfaces of copper clad molybdenum must be as clear and flat as possible to eliminate deleterious cracking or flaking. The copper outer layer has high thermal conductivity and efficient heat spreading qualities. The molybdenum layer inserted between copper layers maintains the overall coefficient of thermal expansion of the laminate in an appropriate range for the intended application. The superior, combined thermomechanical properties of molybdenum and copper have long been known by electrical power engineers who saw the potential of Mo and Cu laminates in many high frequency and high power applications.

MoCu Laminates Models

Cu/Mo/Cu111,121,131,141,13/74/13
Cu/MoCu/Cu141,232,111,212
Cu/Mo/Cu/Mo/Cu51515
Thermal Conductivity170-300 W/m·K
Electrical Conductivity101.3 IACS % Min.
C.T.E‎5.6-12.8 10-6/K
Density9.1-9.88 g/cm3

CMC (Cu/Mo/Cu) is a three-layered copper clad molybdenum laminate consisting of two outer copper layers and one molybdenum core layer. This three-layer structure is available in varying layer thickness ratios, including 1:1:1, 1:2:1, 1:3:1, and 1:4:1.

 

CompositionsDensityElectrical ConductivityCTEThermal ConductivityHardnessElectrical Resistivity
g/cm³IACS % Min.10-6 K-1W/m · K-1HVμΩ cm
CMC 1119.3101.38.3250801.7
CMC 1219.55101.37.8210801.7
CMC 1319.66101.36.8190801.7
CMC 1419.75101.36.0180801.7
CMC 13/74/139.88101.35.6170801.7

CPC (Cu/MoCu/Cu) is a copper-molybdenum copper-copper laminated structure. The molybdenum core layer material of CPC is updated from the high-purity molybdenum to molybdenum copper containing 15% to 40% Wt copper. The common CPC model is CPC 141, which has the Mo70Cu30 core layer and 1:4:1 thickness ratio.

 

CompositionsDensityElectrical ConductivityCTEThermal ConductivityHardnessElectrical Resistivity
g/cm³IACS % Min.10-6 K-1W/m · K-1HVμΩ cm
CPC 1419.54101.38.4220801.7
CPC 2329.3101.39.0255801.7
CPC 1119.2101.39.5260801.7
CPC 2129.1101.311.5300801.7

 

SCMC (Cu/Mo/Cu/Mo/Cu) is five layers of molybdenum and copper laminate, consisting of two molybdenum core layers and three copper layers.

 

CompositionsDensityElectrical ConductivityCTEThermal ConductivityHardnessElectrical Resistivity
g/cm³IACS % Min.10-6 K-1W/m · K-1HVμΩ cm
CPC 1419.54101.38.4220801.7
CPC 2329.3101.39.0255801.7
CPC 1119.2101.39.5260801.7
CPC 2129.1101.311.5300801.7
CMC 1119.3101.38.3250801.7
CMC 1219.55101.37.8210801.7
CMC 1319.66101.36.8190801.7
CMC 1419.75101.36.0180801.7
CMC 13/74/139.88101.35.6170801.7
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