Heat spreaders are thermal packing components of semiconductor and electronic devices. Those components have achieved continuous performance breakthroughs in thermal dissipation, largely in response to increasing demand for the higher and higher power density of semiconductor and electronic devices. Heat spreaders are substrates and baseplates placed beneath electronic components. The heat spreader can transfer the heat generated by the electronic components out to reduce its thermal stress.
The first vital property of heat sinks and heat spreaders need to have is efficient heat conductivity. The second is a CTE matched with semiconductor materials, such as Si and GaAs. The well-matched CTEs can reduce the internal mechanical stress caused by temperature differences. If the heat spreader and heat sink fail to efficiently dissipate the heat generated during device operation, the increased temperature will impair the device’s functional stability and service life. A well-matched CTE can reduce internal mechanical stresses caused by temperature differences. Other important qualities in thermal packing materials include good mechanical properties, hermeticity, and chemical stability.
Molybdenum Copper (MoCu) Heat Spreaders
Molybdenum copper an excellent thermal management material used to produce heat spreaders and other electronic packing components. Molybdenum copper heat spreaders and heat sink are efficient heat-dissipating elements. They are important elements in rectifier tubes, thyristors, power modules, laser diodes, microwave tubes, etc. Those high-power density components are common to use in a wide range of electronic devices.
Molybdenum copper heat spreaders and heat sinks exhibit outstanding CTE and thermal conductivity. These are two desirable properties for electronic packing and heat sink materials. The CTE of the molybdenum copper heat spreaders can match with other components by adjusting the Mo Cu composited ratios. The resulting reduced difference in CTE lessens the internal thermal stresses and helps to maintain the device’s operation functionality and reliability. Molybdenum copper exhibits other valuable properties for being an ideal heat spreader material. For example, molybdenum copper possesses high heat resistance, good machinability, and hermicity. Learn more about our molybdenum copper>>>
Copper Molybdenum Copper (CMC) Heat Spreaders
CMC (Cu/Mo/Cu) laminate is a three-layered structure. CMC consists of two outer copper layers and one molybdenum core layer. It is available in varying layer thickness ratios, including 1:1:1, 1:2:1, 1:3:1, and 1:4:1. CMC has a better CT and CTE than Mo and a higher CT than MoCu at the same CTE level. CMC is also more machinable than pure molybdenum and molybdenum copper composites. It is an enhanced thermal dissipating material. Learn more about our CMC, CPC laminates >>>
Copper Molybdenum-Copper Copper (CPC) Heat Spreaders
CPC (Cu/MoCu/Cu) laminate is a copper-molybdenum / copper-copper structure. CPC replaces its core layer from the pure molybdenum to MoCu containing 15% to 40% Wt copper. The molybdenum copper core layer of CPC achieves improved thermal conductivity over CMC. At the same time, CPC keeps the CTE advantages of CMC. It is a further enhanced three-layer laminate based on CMC. The common CPC model is CPC 141, which has the Mo70Cu30 core layer and 1:4:1 thickness ratio. Compared with CMC, CPC achieves more efficient heat dissipation and distribution. In addition, it is more reliable for heat spreaders in LDMOS and GaN/GaS based devices.
Cu/Mo/Cu/Mo/Cu (SCMC) Heat Spreaders
SCMC (Cu/Mo/Cu/Mo/Cu) is five layers of molybdenum and copper laminate. SCMC consists of two molybdenum core layers and three copper layers. The copper layers of our advanced SCMS 51515 have distributed tunnels across the Mo layer. All copper layers can connect with each other through the tunnels. As a result, those tunnels help to consolidate the bonding effect of all layers further. Our SCMC and SCMS have 80% wt. of the copper content in the laminate. Their thermal conductivity can reach 290 W/(M. K). Plus, SCMC and SCMS possess the same excellent electrical conductivity as all other types of MoCu laminates.
Tungsten Copper (WCu) Heat Spreaders
Same as molybdenum copper, tungsten copper has an adjustable CTE range. Tungsten copper with the same copper percentage as molybdenum copper has exhibits higher thermal conductivity than molybdenum copper. However, because of the high density of tungsten, tungsten copper heat spreader are more suitable for less weight-sensitive high-power devices. The compositing fractions of tungsten and copper ranges from W90Cu10 to W60Cu40. The typical W to Cu ratios includes 70/30 and 80/20. Learn more about our tungsten copper>>>
Copper Diamond (CuC) Heat Spreaders
Copper-Diamond (CuC) composites are thermal packing materials for the laser sub-mounts and power transistor substrates of semiconductors. Diamond is the highest heat conductive substance in nature. It displays 2200-2600 W/m · K-1 thermal conductivity and 10-6 K-1 CTE at room temperature. The outstanding thermal conductivity of Copper-Diamond composites makes them ideal heat spreaders for use in high power density and high-frequency electronic devices.