Copper Clad Molybdenum (CPC, CMC, and SCMC) are structures comprised of alternating layers of Mo/MoCu and Cu materials. The molybdenum copper laminates include Cu/Mo/Cu, Cu/MoCu/Cu, Cu/Mo/Cu/Mo/Cu.
Multiple layers of Mo and Cu, or MoCu and Cu, in various combinations, are symmetrically roll-bonded to exacting thickness ratios. These firmly bonded layers must not vary in thickness by more than 10% from specifications. All interfaces of molybdenum copper laminates must be as clear and flat as possible to eliminate deleterious cracking or flaking. The copper outer layer has high thermal conductivity and efficient heat spreading qualities. The molybdenum layer inserted between copper layers maintains the overall coefficient of thermal expansion of the laminate in an appropriate range for the intended application. The superior, combined thermomechanical properties of molybdenum and copper have long been known by electrical power engineers who saw the potential of Mo and Cu laminates in many high frequency and high power applications. Learn more about our heat spreaders and molybdenum copper>>>
MoCu Laminates Models | |
| Cu/Mo/Cu | 111,121,131,141,13/74/13 |
| Cu/MoCu/Cu | 141,232,111,212 |
| Cu/Mo/Cu/Mo/Cu | 51515 |
| Thermal Conductivity | 170-300 W/m·K |
| Electrical Conductivity | 101.3 IACS % Min. |
| C.T.E | 5.6-12.8 10-6/K |
| Density | 9.1-9.88 g/cm3 |
CMC (Cu/Mo/Cu) is a three-layered molybdenum copper laminate consisting of two outer copper layers and one molybdenum core layer. This three-layer structure is available in varying layer thickness ratios, including 1:1:1, 1:2:1, 1:3:1, and 1:4:1.
| Compositions | Density | Electrical Conductivity | CTE | Thermal Conductivity | Hardness | Electrical Resistivity |
| g/cm³ | IACS % Min. | 10-6 K-1 | W/m · K-1 | HV | μΩ cm | |
| CMC 111 | 9.3 | 101.3 | 8.3 | 250 | 80 | 1.7 |
| CMC 121 | 9.55 | 101.3 | 7.8 | 210 | 80 | 1.7 |
| CMC 131 | 9.66 | 101.3 | 6.8 | 190 | 80 | 1.7 |
| CMC 141 | 9.75 | 101.3 | 6.0 | 180 | 80 | 1.7 |
| CMC 13/74/13 | 9.88 | 101.3 | 5.6 | 170 | 80 | 1.7 |
CPC (Cu/MoCu/Cu) is a copper-molybdenum copper-copper laminated structure. The molybdenum core layer material of CPC is updated from the high-purity molybdenum to molybdenum copper containing 15% to 40% Wt copper. The common CPC model is CPC 141, which has the Mo70Cu30 core layer and 1:4:1 thickness ratio.
| Compositions | Density | Electrical Conductivity | CTE | Thermal Conductivity | Hardness | Electrical Resistivity |
| g/cm³ | IACS % Min. | 10-6 K-1 | W/m · K-1 | HV | μΩ cm | |
| CPC 141 | 9.54 | 101.3 | 8.4 | 220 | 80 | 1.7 |
| CPC 232 | 9.3 | 101.3 | 9.0 | 255 | 80 | 1.7 |
| CPC 111 | 9.2 | 101.3 | 9.5 | 260 | 80 | 1.7 |
| CPC 212 | 9.1 | 101.3 | 11.5 | 300 | 80 | 1.7 |
SCMC (Cu/Mo/Cu/Mo/Cu) is five layers of molybdenum and copper laminate, consisting of two molybdenum core layers and three copper layers.
| Compositions | Density | Electrical Conductivity | CTE | Thermal Conductivity | Hardness | Electrical Resistivity |
| g/cm³ | IACS % Min. | 10-6 K-1 | W/m · K-1 | HV | μΩ cm | |
| CPC 141 | 9.54 | 101.3 | 8.4 | 220 | 80 | 1.7 |
| CPC 232 | 9.3 | 101.3 | 9.0 | 255 | 80 | 1.7 |
| CPC 111 | 9.2 | 101.3 | 9.5 | 260 | 80 | 1.7 |
| CPC 212 | 9.1 | 101.3 | 11.5 | 300 | 80 | 1.7 |
| CMC 111 | 9.3 | 101.3 | 8.3 | 250 | 80 | 1.7 |
| CMC 121 | 9.55 | 101.3 | 7.8 | 210 | 80 | 1.7 |
| CMC 131 | 9.66 | 101.3 | 6.8 | 190 | 80 | 1.7 |
| CMC 141 | 9.75 | 101.3 | 6.0 | 180 | 80 | 1.7 |
| CMC 13/74/13 | 9.88 | 101.3 | 5.6 | 170 | 80 | 1.7 |