Copper molybdenum properties perfectly combine the high thermal conducting property of copper and the low thermal expanding property of molybdenum together. In normal and medium temperature conditions, molybdenum copper properties exhibit good strength and malleability. When the temperature condition exceeds the melting temperature of copper, the copper will be liquefied and evaporated to absorb the heat. Copper molybdenum alloy is mainly used to produce a vacuum and high-temperature components, as well as thermoelectric cooling elements.
- Compatible coefficient of thermal expansion
- Outstanding electrical and thermal conductivity
- High hermeticity
- Good solderability
Copper Molybdenum Properties as Heat Sinks and Heat Spreaders
Copper molybdenum properties include outstanding electrical and thermal conductivity—two highly-desirable molybdenum copper properties for electronic packing and heat sink materials used in high power and frequency electronic devices. Composites of Mo and Cu are available in a wide range of ratios, from Mo90Cu10 to Mo60Cu40.
The coefficient of thermal expansions (CTEs) of the Moly copper alloy components, such as heat sinks and heat spreaders, can be matched with the CTEs of other device elements by adjusting the range of composited ratios. The resulting reduced difference of coefficient of thermal expansions significantly improves device functionality and reliability by minimizing internal thermal stresses.
In addition to excellent conductivity and tailorable CTE, copper molybdenum properties include other desirable mechanical properties, including heat resistance, machinability, and hermicity for use in heat-dissipating and packing materials. For these and other reasons, Molybdenum copper is a favorite thermal management material for heatsinks and supporting materials in a wide range of high power density electronic devices, including rectifier tubes; thyristors; power modules; laser diodes; microwave tubes; etc. Such devices are commonly used in components of microwave transmission, power conversion, and automatic control modules.
Copper Molybdenum Properties as Electrical contacts and electrodes
Copper molybdenum is an ideal material for electrical contacts and electrodes requiring strong resistance to high-temperature electrical arcs. The melting point of copper (1,083 ℃) is 1,600℃ lower than the melting point of molybdenum (4,639℃). When the working temperature of Moly copper contacts and electrodes exceeds 1,083 ℃, the copper begins to progressively evaporate out of the molybdenum skeleton structure. The evaporation largely expels the internal heat by its cooling effects and causes negligible deformation to the electrical contacts and electrodes. Additional molybdenum copper properties of these Moly copper components include excellent arc erosion resistance at high temperatures, superior machinability, and suitability for high fusion welding. More about Outstanding Properties of Copper Molybdenum >>>