Tungsten High Temperature Furnace Tungsten high temperature resistance and melting point make it the most common choice for use in applications like high-temperature furnaces, whose heating elements, heat shields, and…
Tungsten Strengthening Alloy Tungsten alloy includes solid solution strengthening alloy, dispersion strengthening alloy, precipitation strengthening alloy, compositing strengthening alloy, and tungsten composited alloy containing copper, silver, or cemented carbide. Solid…
Physical Properties of Tungsten Tungsten possesses numerous physical properties that are unique among metals. For example, the melting point of tungsten can reach up to 3410°C—the highest among all metals—and…
Mechanical Properties' Impacts on Processing Tungsten and Molybdenum Materials The mechanical properties of tungsten and molybdenum include elastic and inelastic reactions under the action of external forces. In the stamping process…
Refractory metals, tungsten and molybdenum, are easily influenced by their chemical environments, such as oxidation, corrosion, and volatilization. Refractory metals and their alloys are structural materials exhibiting high-temperature resistance. These…
Numerous types of researches on tungsten copper composites sintering technologies are going on along with the increasing applications development and different performance requirements. Many tungsten copper sintering methods are in…
Tungsten Copper and Molybdenum Copper are pseudo-alloys made of high melting point tungsten, molybdenum, and high conductivity copper by powder metallurgy process. Tungsten Copper and Molybdenum Copper properties include excellent electrical…
Moly copper (MoCu) and tungsten copper (WCu) composites are ideal materials for fabricating heat sinks and heat spreaders. Moly copper and tungsten copper provide the outstanding thermal management properties required…
Copper Clad Molybdenum (CPC, CMC, and SCMC) are structures comprised of alternating layers of Mo/MoCu and Cu materials. The molybdenum copper laminates include Cu/Mo/Cu, Cu/MoCu/Cu, Cu/Mo/Cu/Mo/Cu. Multiple layers of Mo…
Heat spreaders are thermal packing components of semiconductor and electronic devices. Those components have achieved continuous performance breakthroughs in thermal dissipation, largely in response to increasing demand for the higher…